Lead-free Soldering with N2
About 78% of the atmosphere is nitrogen and about 21%, or the remainder,
is oxygen. Oxygen is an active gas that promotes the respiration of
living things and combustion. Nitrogen is an inactive gas that is
difficult to combine with other substances. The membrane segregation system from Japan Unix enables generation of highly concentrated (95% - 99.9%) nitrogen gas merely by supplying compressed air... Compressed air in... Nitrogen out!
By using the UNX range of nitrogen generators in your process you can:
- Solder without fear of oxide film contamination
- Reduce voids in the final solder joint
- Reduce the number of dry-joint due to poor wetting
- Improve your solder spreading ratio
- Reduce, dramatically, solder bridges
- Reduce, dramatically, solder whiskers
- Increase throughput due to faster wetting and flow
- Improve repeatability
- Improve joint finish by avoiding overheating
- Minimise solder balls and solder splashes
- Increase solder tip life
- Solder using a less aggressive flux
- Use reduced flux-content solder wire to as low as 1% (Japan Unix NitroFlux wire)
The following shows some of the differences in finish with and without a
UNX nitrogen generator on a 0.65mm pitch QFP...
